Standard specification
IEEE 1101.1/10/11; PICMG3.0 R3.0
System characteristics
Supports up to 2 slots.
Supports 8U6HP 280mm front card insertion and 8U6HP 70mm rear card insertion.
Point-to-point backplane.
Redundant hot swappable fan disk.
Optional System Control Protocol.
Optional PEM or PMM module.
Working environment temperature: 0-50 ℃.
Storage temperature: -20~+85 ℃.
Technical parameter
| Model | 792841002-xxx | |||
| Specifications | 2U2S |
Backboard
|
Base passageway | 1000 Base_T |
| Card insertion direction | horizontal direction | Fabric passageway | 3.125 Gbps LVDS | |
| External dimensions (W x H x D, mm) | 482.6 x 88 x 386 | Node slot | 2 | |
| weight | 6.8kg | Exchange slot | 0 | |
| Heat dissipation capacity | Right in and left out | Topological structure | Point to point | |
| Maximum 200W per slot | IPMB | Point to point | ||
| Controllable speed | Update passageway | have | ||
| colour | black | CLK1 | have | |
| Power supply capacity | Dual DC-48V or dual AC 220V, with a maximum output power of 800W | CLK2 | have | |
| System Control Protocol | IPMI 1.5 or SIMP | CLK3 | have | |